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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto led displayproduct data sheetLTD-4830CKR-P spec no.: ds30-2013-0042effective date: 06/12/2013revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 ckr - p page: 1 of 1 1 bns - od - c131/a4 led display lt d - 4830c k r - p data sheet item description by date 1 new spec reo lin 20 1 2 /0 8 / 15
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 2 of 1 1 bns - od - c131/a4 features 0.3 9 inch ( 1 0 .0 mm) digit height continuous uniform segments low power requirement excellent char acters appearance high brightness & high contrast wide viewing angle solid state reliability categorized for luminous intensity smd display lead free package (according to ro hs ) description the ltd - 4830ck r - p is a 0.3 9 inch ( 1 0 .0 mm) digit hei ght dual di git smd display . this device uses as - alingap super red led chips ( alingap epi on gaas substrate) . the display has gray face and white segments. device part no. description allngap red common anode ltd - 4830ck r - p
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 3 of 1 1 bns - od - c131/a4 package dimensions notes: 1. al l dimensions are in millimeters. tolerances are ? 0.25 mm (0.01) unless otherwise noted. 2. pin tips shift tolerance is ? 0.4 mm. solder pad vs painting diagram notes : 1. plastic pins burr max. 0. 14 mm . 2. all dimensions are in millimeters. tolerances are ? 0.25mm (0.01) unless otherwise noted. 3. solder pad materials and thickness: cu: 1200 inch ni: min 150 inch au: 4 inch . r e fle cto r p c b s o ld e r p a d p a in tin g p la stic b u rr 0 .1 4 m m m a x c u 1 2 0 0 in ch m in n i 1 5 0 in ch m in a u 4 in ch p a in tin g 4 0 0 in ch s c a le : 5 :1 0 .1 4 m m
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 4 of 1 1 bns - od - c131/a4 internal circuit diagram
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 5 of 1 1 bns - od - c131/a4 pin connection no. connection 1 cathode ( digit1 e) 2 cathode (digit1 d) 3 common anode (digit 1) 4 cathode (digit1 c) 5 cathode (digit1 dp) 6 cathode (digit2 e) 7 cathode (digit2 d) 8 common anode (digit 2) 9 cathode (digit 2 c) 1 0 cathode (digit2 dp) 11 cathode (digit2 b) 12 cathode (digit2 a) 13 common anode (digit 2) 14 cathode (digit2 f) 15 cathode (digit2 g) 16 cathode (digit1 b) 17 cathode (digit1 a) 18 common anode (digit 1) 19 cathode (digit1 f) 20 cat hode (digit1 g)
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 6 of 1 1 bns - od - c131/a4 absolute maximum rating at ta = 25 o c parameter maximum rating unit power dissipation per segment 7 0 mw peak forward current per segment (frequency 1khz,10% duty cycle ) 60 ma continuous forward current per segment 2 5 ma forw a rd cur rent derating from 25 c 0. 2 8 ma/ c operating temperature range - 35 c to + 105 c storage temperature range - 35 c to + 105 c electrical / optical characteristics at ta = 25 o c parameter symbol min. typ. max. unit test condition luminous intensity iv 501 1700 f = 1 ma peak emission wavelength ? 639 nm i f = 20 ma spectral line half - width ? ? f = 20 ma dominant wavelength ? f = 20 ma forward voltage per segment v f 2.0 5 2. 6 v i f = 20 ma reverse current per segment (2) i r 10 0 r = 5 v lumi nous intensity matching ratio i v - m 2:1 i f = 1 ma note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie (commision internationale de leclairage) eye - response curve. 2. reverse voltage is only for ir test. it can not continue to operate at this situation. 3. cross t alk specification Q 2.5%
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 7 of 1 1 bns - od - c131/a4 typical electrical / optical characteristic curves (25 o c ambient temperature unless otherwise noted)
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 8 of 1 1 bns - od - c131/a4 smt soldering instruction note: 1. recommended soldering condition: reflow soldering (two times only) solde ring iron (one time only) pre - heat: pre - heat time: peak temperature: soldering time: 120~150 c. 120sec. max. 260 c max. 5sec. max. temperature soldering time 300 c max. 3sec. max. 2. number of reflow process shall be less than 2 times, and cooling proc ess to normal temperature is required between the first and the second soldering process .
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 9 of 1 1 bns - od - c131/a4 recommended soldering pattern note: all dimensions are in millimeters. packing reel dimensions ps 6 05 03 04 01 00 02 9 2 11 12 10 1 7 8 4 3 6 5
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 10 of 1 1 bns - od - c131/a4 pac king carrier dimensions 1. taping parts : 2. trailer part/ leader part : 1 . 1 0 spro cket h ole pitch cu m ulative tolerance 0 .20. 3 . m aterial : b lack c o ndu ctive p olystyrene a lloy. 2 . c arrier cam ber is w ith in 1 m m in 2 50 m m . 4 . a ll dim ensio ns m eet e ia -48 1-c requirem ents. 6 . p ack in g leng th p er 2 2" reel : 35.5 m eters. 5 . t hickness : 0 .30 0.05m m . 7 . c om p onent load p er 13" reel:550 p c s (40m m m in .) (400m m m in .) (40m m m in .) d ir e c t io n o f p u l l in g o u t
lite - on technology corpor ation property of lite - on only part no.: lt d - 4830 c k r - p page: 11 of 1 1 bns - od - c131/a4 m oisture proof packaging all n/d smd displays are shipped in moisture proof package. the display s should be stored at 30c or less and 90% rh or less. once the package opened, moisture absorption begins. baking conditions i f the parts are not stored in dry conditions, they must be baked b efore r eflow to prevent damage to the parts. package temperature time in reel 60 o c R o c R o c R baking should only be done once. units in a sealed moisture - proof package package is opened (unsealed) environment less than 30 o c, and less than 60% rh? perform recommended baking conditions baking is not necessary package is opened more than 1 week days? yes no yes no

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